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1 Ergebnisse
1
Temperature field simulation of Double-fracture Disconnect ..:
, In:
2023 10th International Forum on Electrical Engineering and Automation (IFEEA)
,
Li, Jinbin
;
Yang, Guang
;
Cheng, Zihao
... - p. 669-672 , 2023
Link:
https://doi.org/10.1109/IFEEA60725.2023.10429137
RT T1 <cTitle>2023 10th International Forum on Electrical Engineering and Automation (IFEEA)</cTitle>: T1 <Title>Temperature field simulation of Double-fracture Disconnect Switch in 110kV GIS</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10429137&Exemplar=1&LAN=DE A1 Li, Jinbin A1 Yang, Guang A1 Cheng, Zihao A1 Zhang, Chao A1 Yang, Hang A1 Xia, Tian YR 2023 K1 Electrical engineering K1 Temperature distribution K1 Solid modeling K1 Switches K1 Finite element analysis K1 Gas insulation K1 Switching circuits K1 GIS K1 DDS K1 temperature rise K1 finite element method K1 temperature field SP 669 OP 672 LK http://dx.doi.org/https://doi.org/10.1109/IFEEA60725.2023.10429137 DO https://doi.org/10.1109/IFEEA60725.2023.10429137 SF ELIB - SuUB Bremen
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