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1 Ergebnisse
1
In Situ Study of Electromigration in Eutectic Tin-Bismuth P..:
, In:
2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific)
,
Singh, Prabjit
;
Palmer, L.
;
Hamid, M.
... - p. 1-6 , 2024
Link:
https://doi.org/10.23919/PanPacific60013.2024.10436519
RT T1 <cTitle>2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific)</cTitle>: T1 <Title>In Situ Study of Electromigration in Eutectic Tin-Bismuth Planar Solder Joints</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10436519&Exemplar=1&LAN=DE A1 Singh, Prabjit A1 Palmer, L. A1 Hamid, M. A1 Wassick, T. A1 Campbell, E. A1 Aspandiar, R. F. A1 Franco, B. A1 Fu, H. A1 Vasudevan, V. A1 Allen, A. A1 Howell, K. A1 Murayama, K. A1 Zhang, H. A1 Lifton, A. A1 Munson, T. A1 Middleton, S. A1 Coyle, Richard A1 Sarangapani, M. YR 2024 K1 Resistance K1 Electromigration K1 Bismuth K1 Microstructure K1 Soldering K1 Anodes K1 Cathodes K1 tin-bismuth K1 planar solder K1 microstructural evolution SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.23919/PanPacific60013.2024.10436519 DO https://doi.org/10.23919/PanPacific60013.2024.10436519 SF ELIB - SuUB Bremen
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