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1 Ergebnisse
1
TCF-Tailoring Vertically Stepped Structures for Temperature..:
, In:
2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)
,
Lan, Kai-Wei
;
Chung, I-Fei
;
Tsai, Chun-Pu
.. - p. 140-143 , 2024
Link:
https://doi.org/10.1109/MEMS58180.2024.10439387
RT T1 <cTitle>2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)</cTitle>: T1 <Title>TCF-Tailoring Vertically Stepped Structures for Temperature Insensitive CMOS-MEMS Resonators</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10439387&Exemplar=1&LAN=DE A1 Lan, Kai-Wei A1 Chung, I-Fei A1 Tsai, Chun-Pu A1 Chen, Ting-Yi A1 Li, Wei-Chang YR 2024 SN 2160-1968 K1 Temperature sensors K1 Temperature distribution K1 Resonant frequency K1 Metals K1 Voltage K1 Silicon K1 Tuning K1 CMOS-MEMS K1 resonators K1 temperature compensation K1 temperature coefficient of frequency K1 TCF SP 140 OP 143 LK http://dx.doi.org/https://doi.org/10.1109/MEMS58180.2024.10439387 DO https://doi.org/10.1109/MEMS58180.2024.10439387 SF ELIB - SuUB Bremen
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