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1 Ergebnisse
1
Nanospires Insulation Penetrator for Reliable on-Touch Elec..:
, In:
2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)
,
Shimamura, Ryugo
;
Misumi, Kei
;
Yasunaga, Shun
... - p. 687-690 , 2024
Link:
https://doi.org/10.1109/MEMS58180.2024.10439452
RT T1 <cTitle>2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)</cTitle>: T1 <Title>Nanospires Insulation Penetrator for Reliable on-Touch Electrical Connection</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10439452&Exemplar=1&LAN=DE A1 Shimamura, Ryugo A1 Misumi, Kei A1 Yasunaga, Shun A1 Higo, Akio A1 Nakane, Ryosho A1 Mita, Yoshio YR 2024 SN 2160-1968 K1 Micromechanical devices K1 Semiconductor device measurement K1 Insulators K1 Admittance K1 Flip-chip devices K1 Surface treatment K1 Sensor arrays K1 Nanospire K1 3D integration K1 native oxides K1 chiplets K1 advanced packaging K1 biochemical sensors SP 687 OP 690 LK http://dx.doi.org/https://doi.org/10.1109/MEMS58180.2024.10439452 DO https://doi.org/10.1109/MEMS58180.2024.10439452 SF ELIB - SuUB Bremen
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