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1 Ergebnisse
1
Demonstrating Electrical Connection on Reconstituted ASIC C..:
, In:
2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)
,
Wei, Wei
;
Zhang, Lei
;
Tobback, Bert
... - p. 1150-1153 , 2024
Link:
https://doi.org/10.1109/MEMS58180.2024.10439543
RT T1 <cTitle>2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)</cTitle>: T1 <Title>Demonstrating Electrical Connection on Reconstituted ASIC Chips on 8-Inch Silicon Wafer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10439543&Exemplar=1&LAN=DE A1 Wei, Wei A1 Zhang, Lei A1 Tobback, Bert A1 Visker, Jakob A1 Stakenborg, Tim A1 Karve, Gauri A1 Tezcan, Deniz S. YR 2024 SN 2160-1968 K1 Application specific integrated circuits K1 Semiconductor device measurement K1 Silicon K1 Foundries K1 Microfluidics K1 Substrates K1 Standards K1 Wafer reconstitution K1 wafer level fan-out K1 RDL K1 microfluidics K1 hybrid integration SP 1150 OP 1153 LK http://dx.doi.org/https://doi.org/10.1109/MEMS58180.2024.10439543 DO https://doi.org/10.1109/MEMS58180.2024.10439543 SF ELIB - SuUB Bremen
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