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1 Ergebnisse
1
ASIC Integration via Polymer Ultrasonic Bump Bonding to A 6..:
, In:
2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)
,
Yoo, James Jung
;
Meng, Ellis
- p. 392-395 , 2024
Link:
https://doi.org/10.1109/MEMS58180.2024.10439599
RT T1 <cTitle>2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)</cTitle>: T1 <Title>ASIC Integration via Polymer Ultrasonic Bump Bonding to A 64-Channel Penetrating Parylene Multielectrode Array</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10439599&Exemplar=1&LAN=DE A1 Yoo, James Jung A1 Meng, Ellis YR 2024 SN 2160-1968 K1 Application specific integrated circuits K1 Wires K1 Acoustics K1 Recording K1 Polymers K1 Bonding K1 Standards K1 ASIC integration K1 hybrid integration K1 polymer microelectrode array K1 flexible neural probes K1 Parylene C SP 392 OP 395 LK http://dx.doi.org/https://doi.org/10.1109/MEMS58180.2024.10439599 DO https://doi.org/10.1109/MEMS58180.2024.10439599 SF ELIB - SuUB Bremen
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