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1 Ergebnisse
1
Design of the 28 GHz Antenna-In-Package (AIP) Using Glass E..:
, In:
2023 Asia-Pacific Microwave Conference (APMC)
,
Kim, Su-Geun
;
Lee, Ju-Yong
;
Jang, Hyun-Je
... - p. 372-374 , 2023
Link:
https://doi.org/10.1109/APMC57107.2023.10439769
RT T1
2023 Asia-Pacific Microwave Conference (APMC)
: T1
Design of the 28 GHz Antenna-In-Package (AIP) Using Glass Embedded IC Technology
UL https://suche.suub.uni-bremen.de/peid=ieee-10439769&Exemplar=1&LAN=DE A1 Kim, Su-Geun A1 Lee, Ju-Yong A1 Jang, Hyun-Je A1 Yu, Je-In A1 Min, Byung-Wook A1 Yook, Jong-Min YR 2023 K1 Integrated circuits K1 Wireless communication K1 Waveguide transitions K1 Glass K1 Insertion loss K1 Packaging K1 Substrates K1 glass embedded IC technology K1 front-end-module (FEM) K1 coaxial through-glass-via (CO-TGV) K1 stack antenna K1 coplanar waveguide with ground (G-CPW) bump transition SP 372 OP 374 LK http://dx.doi.org/https://doi.org/10.1109/APMC57107.2023.10439769 DO https://doi.org/10.1109/APMC57107.2023.10439769 SF ELIB - SuUB Bremen
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