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1
33.7 An Adhesive Interposer-Based Reconfigurable Multi-Sens..:
, In:
2024 IEEE International Solid-State Circuits Conference (ISSCC)
,
Cho, Jeonghoon
;
Pyeon, You Jang
;
Yeom, Junyeong
... - p. 554-556 , 2024
Link:
https://doi.org/10.1109/ISSCC49657.2024.10454293
RT T1 <cTitle>2024 IEEE International Solid-State Circuits Conference (ISSCC)</cTitle>: T1 <Title>33.7 An Adhesive Interposer-Based Reconfigurable Multi-Sensor Patch Interface with On-Chip Application Tunable Time-Domain Feature Extraction</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10454293&Exemplar=1&LAN=DE A1 Cho, Jeonghoon A1 Pyeon, You Jang A1 Yeom, Junyeong A1 Kim, Hyunjoong A1 Cho, Sanghyeon A1 Kim, Yonggi A1 Kim, Taejung A1 Kwak, Jong-Hyun A1 Choi, Geonjun A1 Lee, Yoonsik A1 Shin, Heungjoo A1 Jeong, Hoon Eui A1 Kim, Jae Joon YR 2024 SN 2376-8606 K1 Integrated circuits K1 Voice activity detection K1 Quantization (signal) K1 Medical services K1 Feature extraction K1 Real-time systems K1 System-on-chip SP 554 OP 556 LK http://dx.doi.org/https://doi.org/10.1109/ISSCC49657.2024.10454293 DO https://doi.org/10.1109/ISSCC49657.2024.10454293 SF ELIB - SuUB Bremen
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