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11.1 AMD InstinctTM MI300 Series Modular Chiplet Package – ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Smith, Alan ; Chapman, Eric ; Patel, Chintan... - p. 490-492 , 2024
Link: https://doi.org/10.1109/ISSCC49657.2024.10454441