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1 Ergebnisse
1
14.10 34.7A/mm2 Scalable Distributed All-Digital 6×6 Dot-LD..:
, In:
2024 IEEE International Solid-State Circuits Conference (ISSCC)
,
Lee, Yong-Jin
;
Jang, Woojin
;
Bae, Hong-Hyun
.. - p. 272-274 , 2024
Link:
https://doi.org/10.1109/ISSCC49657.2024.10454454
RT T1
2024 IEEE International Solid-State Circuits Conference (ISSCC)
: T1
14.10 34.7A/mm2 Scalable Distributed All-Digital 6×6 Dot-LDOs Featuring Freely Linkable Current-Sharing Network: A Fine-Grained On-Chip Power Delivery Solution in 28nm CMOS
UL https://suche.suub.uni-bremen.de/peid=ieee-10454454&Exemplar=1&LAN=DE A1 Lee, Yong-Jin A1 Jang, Woojin A1 Bae, Hong-Hyun A1 Cho, Jeong-Hyun A1 Kim, Hyun-Sik YR 2024 SN 2376-8606 K1 Sensitivity K1 Thermal resistance K1 Scalability K1 Power grids K1 Regulation K1 System-on-chip K1 Solid state circuits SP 272 OP 274 LK http://dx.doi.org/https://doi.org/10.1109/ISSCC49657.2024.10454454 DO https://doi.org/10.1109/ISSCC49657.2024.10454454 SF ELIB - SuUB Bremen
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