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1 Ergebnisse
1
11.2 A 3D integrated Prototype System-on-Chip for Augmented..:
, In:
2024 IEEE International Solid-State Circuits Conference (ISSCC)
,
Wu, Tony F.
;
Liu, Huichu
;
Sumbul, H. Ekin
... - p. 210-212 , 2024
Link:
https://doi.org/10.1109/ISSCC49657.2024.10454529
RT T1 <cTitle>2024 IEEE International Solid-State Circuits Conference (ISSCC)</cTitle>: T1 <Title>11.2 A 3D integrated Prototype System-on-Chip for Augmented Reality Applications Using Face-to-Face Wafer Bonded 7nm Logic at <2μm Pitch with up to 40% Energy Reduction at Iso-Area Footprint</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10454529&Exemplar=1&LAN=DE A1 Wu, Tony F. A1 Liu, Huichu A1 Sumbul, H. Ekin A1 Yang, Lita A1 Baheti, Dipti A1 Coriell, Jeremy A1 Koven, William A1 Krishnan, Anu A1 Mittal, Mohit A1 Moreira, Matheus Trevisan A1 Waugaman, Max A1 Ye, Laurent A1 Beigne, Edith YR 2024 SN 2376-8606 K1 Three-dimensional displays K1 Stacking K1 Memory management K1 Prototypes K1 Machine learning K1 Signal processing K1 System-on-chip SP 210 OP 212 LK http://dx.doi.org/https://doi.org/10.1109/ISSCC49657.2024.10454529 DO https://doi.org/10.1109/ISSCC49657.2024.10454529 SF ELIB - SuUB Bremen
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