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1 Ergebnisse
1
A Highly-Sensitive and Compact Interconnect Delay Monitorin..:
, In:
2024 International Conference on Electronics, Information, and Communication (ICEIC)
,
Noh, Seung-Mo
;
Kim, Seungkyu
;
Lee, Seo-Yoon
. - p. 1-4 , 2024
Link:
https://doi.org/10.1109/ICEIC61013.2024.10457196
RT T1 <cTitle>2024 International Conference on Electronics, Information, and Communication (ICEIC)</cTitle>: T1 <Title>A Highly-Sensitive and Compact Interconnect Delay Monitoring Circuit for 3-Dimensional System Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457196&Exemplar=1&LAN=DE A1 Noh, Seung-Mo A1 Kim, Seungkyu A1 Lee, Seo-Yoon A1 Kwon, Kee-Won YR 2024 SN 2767-7699 K1 Resistance K1 Process monitoring K1 Degradation K1 Sensitivity K1 Simulation K1 Integrated circuit interconnections K1 Capacitance K1 Interconnect RC delay monitoring K1 process variation K1 ring-oscillator K1 inverted-inverter SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEIC61013.2024.10457196 DO https://doi.org/10.1109/ICEIC61013.2024.10457196 SF ELIB - SuUB Bremen
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