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1 Ergebnisse
1
An Electromigration Study of Cu Pillar Interconnects in Fli..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Tsai, Min-Yan
;
Kao, Chin-Li
;
Wang, Shan-Bo
... - p. 326-332 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457564
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>An Electromigration Study of Cu Pillar Interconnects in Flip-chip QFN Packaging under Extreme Conditions for High-power Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457564&Exemplar=1&LAN=DE A1 Tsai, Min-Yan A1 Kao, Chin-Li A1 Wang, Shan-Bo A1 Lin, Yung-Sheng A1 Chiu, Meng-Chun A1 Liang, Chien-Lung YR 2023 K1 Resistance K1 Electromigration K1 Failure analysis K1 Predictive models K1 Mathematical models K1 Behavioral sciences K1 Microstructure SP 326 OP 332 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457564 DO https://doi.org/10.1109/EPTC59621.2023.10457564 SF ELIB - SuUB Bremen
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