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1 Ergebnisse
1
Deca & ASE M-Series Bridge Die Compensation & Adaptive Patt..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Sandstrom, Clifford
;
Talain, Erick
;
Olson, Timothy
... - p. 797-803 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457602
RT T1
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
: T1
Deca & ASE M-Series Bridge Die Compensation & Adaptive Patterning in a Multi-Die Module in 600 mm Format
UL https://suche.suub.uni-bremen.de/peid=ieee-10457602&Exemplar=1&LAN=DE A1 Sandstrom, Clifford A1 Talain, Erick A1 Olson, Timothy A1 Jose, Benedict San A1 Fang, Jen-Kuang A1 Yang, Ping-Feng A1 Huang, Sheng-Feng A1 Shen, Ping-Ching YR 2023 K1 Bridges K1 Scalability K1 Production K1 Manufacturing K1 System-on-chip K1 Printers K1 Task analysis SP 797 OP 803 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457602 DO https://doi.org/10.1109/EPTC59621.2023.10457602 SF ELIB - SuUB Bremen
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