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Low-temperature solder for low-carbon emitting process:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Wang, Yi-Wun ; Liang, Hua-Tui ; Tseng, Tzu-Ting. - p. 231-234 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457607