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1 Ergebnisse
1
Effect of Scribe Line Metal Layout on Wafer Saw Top Edge Ch..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Barbosa, Ronald
;
Pinili, Ton
;
Estremera, Leo
... - p. 139-143 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457610
RT T1
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
: T1
Effect of Scribe Line Metal Layout on Wafer Saw Top Edge Chipping for Silicon Power Devices
UL https://suche.suub.uni-bremen.de/peid=ieee-10457610&Exemplar=1&LAN=DE A1 Barbosa, Ronald A1 Pinili, Ton A1 Estremera, Leo A1 Brizar, Guy A1 Rolofson, Kirk A1 Barth, Will A1 McGlone, John A1 Hose, Sallie A1 Gambino, Jeff YR 2023 K1 Semiconductor device measurement K1 Layout K1 Metals K1 Power distribution K1 Silicon K1 Thickness measurement K1 Electronics packaging K1 wafer saw K1 edge chipping K1 copper K1 power semiconductor SP 139 OP 143 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457610 DO https://doi.org/10.1109/EPTC59621.2023.10457610 SF ELIB - SuUB Bremen
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