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Immediate thermal performance evaluation of the power modul..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Sudo, Tomoya ; Hiraoka, Gakuto ; Yu, Qiang... - p. 1037-1042 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457611