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Development of micron-sized Ag-Si composite paste die attac..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chen, Chuantong ; Liu, Yang ; Li, Wangyun... - p. 548-551 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457613