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Numerical and Experimental Investigation of Package Warpage..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Zhang, Xiaowu ; Lim, Sharon Pei Siang ; Lau, Boon Long... - p. 734-737 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457614