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1 Ergebnisse
1
Improving Board Level Reliability of Ultra Thin PCBA by Sys..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Jiang, Yiming
;
Shi, Hongbin
;
Li, Mengyuan
. - p. 922-925 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457616
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Improving Board Level Reliability of Ultra Thin PCBA by Systematic Novel Solutions</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457616&Exemplar=1&LAN=DE A1 Jiang, Yiming A1 Shi, Hongbin A1 Li, Mengyuan A1 Lv, Xiang YR 2023 K1 Encapsulation K1 Systematics K1 Capacitors K1 Finite element analysis K1 Reliability K1 Optimization K1 Electronics packaging SP 922 OP 925 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457616 DO https://doi.org/10.1109/EPTC59621.2023.10457616 SF ELIB - SuUB Bremen
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