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1 Ergebnisse
1
An Extensive Study of the Effects of Packaging Structure an..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Lyu, Guang-Chao
;
Chen, Bin
;
Zhang, Xin-Ping
... - p. 647-654 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457640
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>An Extensive Study of the Effects of Packaging Structure and Material Properties on Reliability of Advanced Packages by Charactering the Stress Singularities at Interface Corners</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457640&Exemplar=1&LAN=DE A1 Lyu, Guang-Chao A1 Chen, Bin A1 Zhang, Xin-Ping A1 Zhou, Min-Bo A1 Ke, Chang-Bo A1 Mai, Yiu-Wing YR 2023 K1 Materials reliability K1 Packaging K1 Finite element analysis K1 Reliability K1 Soldering K1 Junctions K1 Integrated circuit reliability SP 647 OP 654 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457640 DO https://doi.org/10.1109/EPTC59621.2023.10457640 SF ELIB - SuUB Bremen
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