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Integration of plasma dicing in the collective die to wafer..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Suhard, Samuel
;
Kennes, Koen
;
Bex, Pieter
... - p. 144-149 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457656
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Integration of plasma dicing in the collective die to wafer hybrid bonding process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457656&Exemplar=1&LAN=DE A1 Suhard, Samuel A1 Kennes, Koen A1 Bex, Pieter A1 Georgieva, Violeta A1 Schleicher, Filip A1 Walsby, Edward A1 Barnett, Richard A1 Jourdain, Anne A1 Beyer, Gerald A1 Beyne, Eric YR 2023 K1 Bonding processes K1 Kelvin K1 Electric variables measurement K1 Tin K1 Plasma measurements K1 Cleaning K1 Distance measurement K1 hybrid bonding K1 plasma dicing die to wafer SP 144 OP 149 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457656 DO https://doi.org/10.1109/EPTC59621.2023.10457656 SF ELIB - SuUB Bremen
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