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Lock-in Thermography judgment for short/leakage/high resist..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Lin, Yu-Ting ; Liu, Cheng-Hsin ; Lin, Yi-Sheng. - p. 346-349 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457660