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1 Ergebnisse
1
Capillary Underfill Flow Simulation and Experimental Study ..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Lai, Jin Yuan
;
Yueh Yang, Shin
;
Lin, Kohan
... - p. 659-663 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457663
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Capillary Underfill Flow Simulation and Experimental Study for Solder Mask Opening and Trace Distribution in Bump Layout Design</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457663&Exemplar=1&LAN=DE A1 Lai, Jin Yuan A1 Yueh Yang, Shin A1 Lin, Kohan A1 Choi, Bongwoo A1 Ong, Yeow Chon A1 Wan Ng, Hong YR 2023 K1 Solid modeling K1 Three-dimensional displays K1 Adhesives K1 Computational fluid dynamics K1 Simulation K1 Layout K1 Tomography SP 659 OP 663 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457663 DO https://doi.org/10.1109/EPTC59621.2023.10457663 SF ELIB - SuUB Bremen
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