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Excellent Reliability Organic Thermal Interface Materials f..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Shimada, Akira ; Sakabe, Yohei ; Fujiwara, Takenori - p. 240-243 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457665