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Challenges of Scaling Down High-Power Performance Flip Chip..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chan, W H ; Lakhera, Nishant ; Uehling, Trent... - p. 435-441 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457667