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1 Ergebnisse
1
Solutions for Process Challenges on Fan-Out Wafer Level Pac..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Chia, Lai Yee
;
Bhuvanendran Nair Gourikutty, Sajay
;
Ho, Soon Wee
- p. 20-23 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457673
RT T1
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
: T1
Solutions for Process Challenges on Fan-Out Wafer Level Packaging of Electronic-Photonic Integration
UL https://suche.suub.uni-bremen.de/peid=ieee-10457673&Exemplar=1&LAN=DE A1 Chia, Lai Yee A1 Bhuvanendran Nair Gourikutty, Sajay A1 Ho, Soon Wee YR 2023 K1 Fabrication K1 Power demand K1 System performance K1 High performance computing K1 Photonic integrated circuits K1 Resists K1 Dielectrics SP 20 OP 23 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457673 DO https://doi.org/10.1109/EPTC59621.2023.10457673 SF ELIB - SuUB Bremen
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