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1 Ergebnisse
1
A Board Level Vibration Test Method for Electronic Industry..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Xie, Dongji
;
Lee, Jeffrey
;
Khaldarov, Valeriy
... - p. 307-315 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457684
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>A Board Level Vibration Test Method for Electronic Industry Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457684&Exemplar=1&LAN=DE A1 Xie, Dongji A1 Lee, Jeffrey A1 Khaldarov, Valeriy A1 Zhang, Andy A1 I, Xue S H A1 X P, Romuald RoucouN A1 Doranga, Sushil A1 Kelly, Brian YR 2023 K1 Vibrations K1 Time-frequency analysis K1 TV K1 Correlation K1 Life estimation K1 Fatigue K1 Harmonic analysis K1 Cu trace cracking K1 high cycle fatigue K1 random vibration K1 sine sweep K1 strain and acceleration calibration K1 solder joint failure SP 307 OP 315 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457684 DO https://doi.org/10.1109/EPTC59621.2023.10457684 SF ELIB - SuUB Bremen
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