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Process Development and Integration on Si Substrate for Ion..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Li, H. Y. ; Liu Huihong, Clarence ; Jaafar, Norhanani... - p. 253-256 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457687