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Design Optimization to Boost Solder Joint Reliability Perfo..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Pan, Ling ; Che, Fa Xing ; Yu, Wei... - p. 674-677 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457693