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Microstructural and mechanical analysis of Cu/Sn/Cu microbu..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Huang, Pin-Wei ; Lin, Ta-Wei ; Duh, Jenq-Gong - p. 488-492 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457695