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1 Ergebnisse
1
The laser cavity electric connection line with SnAg solder ..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Chi, Ting Ta
;
Li, Zhenyu
;
Yu, Haitao
... - p. 12-15 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457696
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>The laser cavity electric connection line with SnAg solder for laser flip chip bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457696&Exemplar=1&LAN=DE A1 Chi, Ting Ta A1 Li, Zhenyu A1 Yu, Haitao A1 Yoo, Jae Ok A1 Sundaram, Arvind A1 Feng, Xu A1 Choong, Chong Ser A1 Lee, Wen YR 2023 K1 Resistance K1 Economics K1 Semiconductor lasers K1 Measurement by laser beam K1 Polyimides K1 Waveguide lasers K1 Etching SP 12 OP 15 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457696 DO https://doi.org/10.1109/EPTC59621.2023.10457696 SF ELIB - SuUB Bremen
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