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Assembly process characterization of 3D Stacking of Heterog..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Siang Lim, Sharon Pei ; Long Lau, Boon ; Chai, Tai Chong. - p. 24-28 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457705