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Package Design Optimization of Thin Mold Double Side System..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Yen, Freedman ; Lin, Vito ; Shih, Teny.. - p. 738-741 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457706