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1 Ergebnisse
1
Investigation of SnAg Superconductivity as Solder Material ..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Ng, Yong Chyn
;
Li, Hongyu
;
Jaafar, Norhanani Binte
... - p. 227-230 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457707
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Investigation of SnAg Superconductivity as Solder Material for Cryogenic Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457707&Exemplar=1&LAN=DE A1 Ng, Yong Chyn A1 Li, Hongyu A1 Jaafar, Norhanani Binte A1 Cheow Siong Lee, Rainer A1 Huang, Ding A1 Lau, Chit Siong A1 Eng Johnson Goh, Kuan A1 Chui, King-Jien YR 2023 K1 Performance evaluation K1 Superconducting materials K1 Temperature K1 Qubit K1 Cryogenics K1 Packaging K1 Tin SP 227 OP 230 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457707 DO https://doi.org/10.1109/EPTC59621.2023.10457707 SF ELIB - SuUB Bremen
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