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The Effect of Cu/SiO2 Rough Interface on TSV Electroplating..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Lv, Weishan ; Lei, Xin ; Liu, Jiaxin. - p. 1086-1089 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457710