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1 Ergebnisse
1
Effect of Reflow on Solder Joint in Low Temperature SnBi So..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Chiong, Kenny
;
Sutiono, Sylvia
;
Kumar, B. Senthil
... - p. 221-226 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457717
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Effect of Reflow on Solder Joint in Low Temperature SnBi Solder Paste</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457717&Exemplar=1&LAN=DE A1 Chiong, Kenny A1 Sutiono, Sylvia A1 Kumar, B. Senthil A1 Miew Wan, Lo A1 Murali, Sarangapani A1 HanWen, Zhang A1 Sig, Kang Sung YR 2023 K1 Temperature K1 System-in-package K1 Apertures K1 Packaging K1 Electronic packaging thermal management K1 Reliability K1 Microstructure K1 LTS K1 SnBiAg K1 Warpage K1 Bi% Diffusion K1 Reflow Profile K1 SAC305 K1 Mixed alloy K1 Printability K1 Intermetallic Microstructure K1 Thermal Cycling K1 Solder and Voids SP 221 OP 226 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457717 DO https://doi.org/10.1109/EPTC59621.2023.10457717 SF ELIB - SuUB Bremen
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