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1 Ergebnisse
1
Characterizing Sub-micron 3D Defects from Intact Advanced P..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Lau, S.H.
;
Gelb, Jeff
;
Gul, Sheraz
... - p. 530-535 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457725
RT T1
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
: T1
Characterizing Sub-micron 3D Defects from Intact Advanced Packages to Wafer Level Packaging using a Suite of Novel 3D X-ray Tools at Down to 0.3 μm Spatial Resolution
UL https://suche.suub.uni-bremen.de/peid=ieee-10457725&Exemplar=1&LAN=DE A1 Lau, S.H. A1 Gelb, Jeff A1 Gul, Sheraz A1 Qin, Tianzu A1 Lewis, Sylvia A1 Yun, Wenbing YR 2023 K1 Wafer bonding K1 Micrometers K1 Three-dimensional displays K1 Failure analysis K1 X-rays K1 Inspection K1 X-ray tomography SP 530 OP 535 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457725 DO https://doi.org/10.1109/EPTC59621.2023.10457725 SF ELIB - SuUB Bremen
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