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Characterizing Sub-micron 3D Defects from Intact Advanced P..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Lau, S.H. ; Gelb, Jeff ; Gul, Sheraz... - p. 530-535 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457725