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1 Ergebnisse
1
Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bond..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Kiat Goh, Simon Chun
;
Hemanth Kumar, Cheemalamarri
;
Hu, Liangxing
... - p. 404-408 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457728
RT T1
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
: T1
Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing
UL https://suche.suub.uni-bremen.de/peid=ieee-10457728&Exemplar=1&LAN=DE A1 Kiat Goh, Simon Chun A1 Hemanth Kumar, Cheemalamarri A1 Hu, Liangxing A1 Shervonne, Woon A1 Jaafar, Norhanani A1 Khoon Sherry, Yap Lee A1 Huang, Ding A1 Lau, Chit Siong A1 Kumar Karuppannan, Senthil A1 Li, Hongyu A1 Tan, Chuan Seng A1 Chui, King-Jien YR 2023 K1 Wafer bonding K1 Three-dimensional displays K1 Temperature K1 Qubit K1 Integrated circuit interconnections K1 Throughput K1 Wafer scale integration SP 404 OP 408 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457728 DO https://doi.org/10.1109/EPTC59621.2023.10457728 SF ELIB - SuUB Bremen
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