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Packaging strategies for 3D integration of Photonic and Ele..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Bernson, Robert
;
Wakeel, Saif
;
Gupta, Parnika
... - p. 804-808 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457729
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Packaging strategies for 3D integration of Photonic and Electronic chips on a Glass substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457729&Exemplar=1&LAN=DE A1 Bernson, Robert A1 Wakeel, Saif A1 Gupta, Parnika A1 Ranno, Luigi A1 Weninger, Drew A1 Agarwal, Anuradha A1 Serna, Samuel A1 Hu, Juejun A1 Gradkowski, Kamil A1 Kimerling, Lionel A1 O'Brien, Peter YR 2023 K1 Couplings K1 Integrated optics K1 Optical interconnections K1 Three-dimensional displays K1 Glass K1 Packaging K1 Optical coupling SP 804 OP 808 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457729 DO https://doi.org/10.1109/EPTC59621.2023.10457729 SF ELIB - SuUB Bremen
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