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Effect of Tg and modulus on the underfill reliability in pa..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Zhao, Guolin ; Lin, Haoliang ; Peng, Xiaohui.. - p. 564-568 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457731