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Indium-based Flip-chip Interconnect for Cryogenic Packaging:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Jaafar, Norhanani Binte ; Hongyu, Li ; Choong, Chong Ser... - p. 970-973 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457739