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1 Ergebnisse
1
Indium-based Flip-chip Interconnect for Cryogenic Packaging:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Jaafar, Norhanani Binte
;
Hongyu, Li
;
Choong, Chong Ser
... - p. 970-973 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457739
RT T1
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
: T1
Indium-based Flip-chip Interconnect for Cryogenic Packaging
UL https://suche.suub.uni-bremen.de/peid=ieee-10457739&Exemplar=1&LAN=DE A1 Jaafar, Norhanani Binte A1 Hongyu, Li A1 Choong, Chong Ser A1 Yong Chyn, Ng A1 Huang, Ding A1 Lau, Chit Siong A1 Goh, Kuan Eng Johnson A1 Chui, King-Jien YR 2023 K1 Wiring K1 Shape measurement K1 Wires K1 Cryogenics K1 Superconductivity K1 Thermal conductivity K1 Flip-chip devices SP 970 OP 973 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457739 DO https://doi.org/10.1109/EPTC59621.2023.10457739 SF ELIB - SuUB Bremen
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