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1 Ergebnisse
1
Detection of bonding voids in multi-tier stacks with scanni..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Chen, Cong
;
Slabbekoorn, John
;
Bogdanowicz, Janusz
... - p. 320-325 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457746
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Detection of bonding voids in multi-tier stacks with scanning acoustic microscope</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457746&Exemplar=1&LAN=DE A1 Chen, Cong A1 Slabbekoorn, John A1 Bogdanowicz, Janusz A1 Moussa, Alain A1 Zhang, Boyao A1 Schleicher, Filip A1 Hoffrogge, Peter A1 Wiesler, Ingo A1 Khaldi, Wassim A1 Phommahaxay, Alain A1 Beral, Christophe A1 Beyer, Gerald A1 Beyne, Eric A1 Charley, Anne-Laure A1 Leray, Philippe YR 2023 K1 Transducers K1 Image resolution K1 Three-dimensional displays K1 Microscopy K1 Failure analysis K1 System integration K1 Acoustics SP 320 OP 325 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457746 DO https://doi.org/10.1109/EPTC59621.2023.10457746 SF ELIB - SuUB Bremen
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