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1 Ergebnisse
1
Realizing ultra-thin high reliability storage devices with ..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Shi, Hongbin
;
Yang, Chao
;
Zhang, Jianrui
- p. 614-619 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457757
RT T1
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
: T1
Realizing ultra-thin high reliability storage devices with large capacity by package and PCB collaborative design
UL https://suche.suub.uni-bremen.de/peid=ieee-10457757&Exemplar=1&LAN=DE A1 Shi, Hongbin A1 Yang, Chao A1 Zhang, Jianrui YR 2023 K1 Ball grid arrays K1 Collaboration K1 Thermal shock K1 Morphology K1 Packaging K1 Reliability engineering K1 Soldering K1 Universal flash memory chip (UFS) K1 Packaging optimization K1 Reliability K1 Failure analysis SP 614 OP 619 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457757 DO https://doi.org/10.1109/EPTC59621.2023.10457757 SF ELIB - SuUB Bremen
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