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Investigation of Void-free Chip-to-Chip Bonding Methods for..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Yeo, Yi Xuan ; Leong Ching Wai, Eva ; Chen, Daniel Ssu-Han. - p. 869-872 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457764