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1 Ergebnisse
1
Advancing Fine Pitch (< 5μm) Interconnects through Self-Ali..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Dubey, Vikas
;
Wunsch, Dirk
;
Gottfried, Knut
... - p. 469-473 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457767
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Advancing Fine Pitch (< 5μm) Interconnects through Self-Aligned Die-to-Wafer Hybrid Bonding for Chiplet Integration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457767&Exemplar=1&LAN=DE A1 Dubey, Vikas A1 Wunsch, Dirk A1 Gottfried, Knut A1 Kinner, Robert A1 Suroshe, Rajat A1 Kuchler, Matthias A1 Stephan, Ronny A1 Schermer, Sebastian A1 Helke, Christian A1 Hasse, Micha A1 Reuter, Danny A1 Weimer, Maik A1 Schulz, Stefan YR 2023 K1 Liquids K1 Nanometers K1 Market research K1 Surface roughness K1 Rough surfaces K1 Microelectronics K1 Bonding SP 469 OP 473 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457767 DO https://doi.org/10.1109/EPTC59621.2023.10457767 SF ELIB - SuUB Bremen
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