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1 Ergebnisse
1
Cu and barrier CMP process development with fine 1μm Cu bon..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Roy, Sangita Chaki
;
Guan, Chen Gim
;
Venkataraman, Nandini
.. - p. 135-138 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457780
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Cu and barrier CMP process development with fine 1μm Cu bond pad and 2.5 μm pitch for Wafer-to-wafer Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457780&Exemplar=1&LAN=DE A1 Roy, Sangita Chaki A1 Guan, Chen Gim A1 Venkataraman, Nandini A1 Lee, Wen A1 Singh, Navab YR 2023 K1 Three-dimensional displays K1 Planarization K1 Force K1 Process control K1 Surface roughness K1 Rough surfaces K1 Bonding SP 135 OP 138 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457780 DO https://doi.org/10.1109/EPTC59621.2023.10457780 SF ELIB - SuUB Bremen
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