I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

High Thermal EMC Solution Applied in Thin FCCSP:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Su, Pin-Jing ; Wang, Jerry ; Hung, Liang-Yih.. - p. 584-587 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457787