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1 Ergebnisse
1
Hard bond pad plastic deformation study for adhesion estima..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Guarino, L.
;
Caglio, C.
;
Villa, R.
... - p. 687-693 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457872
RT T1
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
: T1
Hard bond pad plastic deformation study for adhesion estimation by 3D FEM modelling of wire bonding process
UL https://suche.suub.uni-bremen.de/peid=ieee-10457872&Exemplar=1&LAN=DE A1 Guarino, L. A1 Caglio, C. A1 Villa, R. A1 Carasi, B. A1 Passagrilli, C. A1 Cecchetto, L. YR 2023 K1 Deformable models K1 Solid modeling K1 Adhesives K1 Deformation K1 Welding K1 Wires K1 Data models SP 687 OP 693 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457872 DO https://doi.org/10.1109/EPTC59621.2023.10457872 SF ELIB - SuUB Bremen
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