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1 Ergebnisse
1
Reliability Prediction and Improvement of Board-Level Therm..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Chen, Dao-Long
;
Chen, Tang-Yuan
;
Lai, Wei-Hong
... - p. 995-998 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457878
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Reliability Prediction and Improvement of Board-Level Thermal Cycling Test for Molded Flip-Chip Ball-Grid-Array Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457878&Exemplar=1&LAN=DE A1 Chen, Dao-Long A1 Chen, Tang-Yuan A1 Lai, Wei-Hong A1 Yin, Wei-Jie A1 Kuo, Chun-Liang A1 Ko, Chun-Yu A1 Cheng, Chi-Min YR 2023 K1 Schedules K1 Parametric study K1 Creep K1 Focusing K1 Materials reliability K1 Predictive models K1 Data models SP 995 OP 998 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457878 DO https://doi.org/10.1109/EPTC59621.2023.10457878 SF ELIB - SuUB Bremen
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